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High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

High Conductivity Bonding Wire,High Bond Strength Gold Plated Silver Wire,Smooth Surface Finish Spooled Wire

High Bond Strength Gold Plated Silver Wire

Smooth Surface Finish Spooled Wire

محل منبع:

چین

نام تجاری:

WINNER

گواهی:

ISO9100

با ما تماس بگیرید
درخواست نقل قول
جزئیات محصول
روکش:
طلا
استحکام پیوند:
عالی
گواهینامه:
ISO 9001
مقاومت در برابر خوردگی:
عالی
کشیدگی:
3-20 ٪
نوع محصول:
سیم اتصال دهنده
پایان سطح:
صاف، مات، بافت دار
قطر:
0.7-1.0mil
مادی:
طلا ، نقره
خلوص:
99.99 ٪
برجسته کردن:

High Conductivity Bonding Wire,High Bond Strength Gold Plated Silver Wire,Smooth Surface Finish Spooled Wire

,

High Bond Strength Gold Plated Silver Wire

,

Smooth Surface Finish Spooled Wire

شرایط پرداخت و حمل و نقل
مقدار حداقل تعداد سفارش
1000 متر
قیمت
999
جزئیات بسته بندی
رول ، بسته بندی نوتیال یا با آرم OEM
زمان تحویل
5-8 روز
شرایط پرداخت
T/T ، D/A ، Western Union
قابلیت ارائه
9999999
محصولات مرتبط
با ما تماس بگیرید
حالا تماس بگیرید
توضیحات محصول
High Conductivity Gold Plated Silver Wire on Spool
Factory Supply Ultra Fine Gold Plated Silver Wire
Gold Plated Silver Spooled Wire combines the high conductivity of silver with the corrosion resistance of gold, making it ideal for scientific research and laboratory use. This specialized wire is engineered for demanding applications where signal integrity must be maintained under extreme conditions.
Key Applications
  • Cryogenic systems and superconducting circuits
  • High-frequency RF and microwave assemblies
  • Quantum computing research
  • Particle detection systems
  • Photonics instrumentation
  • Materials science research
  • Aerospace testing applications
  • Precision engineering projects
  • Advanced sensor development
Product Advantages
  • Superior conductivity with low contact resistance
  • Excellent corrosion resistance from gold plating
  • Consistent signal transmission in extreme environments
  • Spooled format for precise handling in clean rooms
  • Ideal for research setups and laboratory applications
Product Images
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 0 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 1 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 2 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 3 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 4 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 5

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